Sn-Ag-Cu series alloy lead-free non-washable solder paste ● Based on the technical platforms from Europe, America and Japan, it is fully independently developed. ● The innovative R&D capabilities are in line with the ever-evolving SMT process requirements. ● The new rosin resin composite anti-oxidation technology has stable performance and moderate adhesion. ● Excellent wetting property, with anti-drying time exceeding 48 hours, which can better maintain the adhered products. ● Good printi
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商品规格:500g
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Add:2nd Floor, Factory Expansion, No 6, Lvyuan Road, Nanping Science and Technology Industrial Park, Xiangzhou District, Zhuhai City, Guangdong Province, China
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