2026-10-28 10:16:16
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An LED driver module failed its damp-heat chamber test: appearance and process checks all passed, yet the root cause was a number no one had ever verified - the narrowest gap inside the cavity was only 0.4 mm, while the potting compound in use on the line had a viscosity of 12,000 cps. The material bridged and sealed off the top of the gap, leaving sections unprotected and a hidden failure in wait.







Conclusion: answer the four questions first (heat generation and dissipation, narrowest gap, rework, heating conditions), then run the three checks (incoming materials, process, cut-open sampling), and finally keep tools clean. Only when the viscosity lets the material reach everywhere it must does the thermal conductivity figure start to matter.
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