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SMT Red Glue One-Component Chip Adhesive for PCB & BGA Fixation, Heat-Resistant Up to 150 °C, Ideal for LED Modules

SMT Red Glue One-Component Chip Adhesive for PCB & BGA Fixation, Heat-Resistant Up to 150 °C, Ideal for LED Modules

The chip red glue is a one-component, high-temperature and rapid-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards. It has excellent thixotropic properties and is particularly suitable for manual steel screen printing and thick plate printing. It is also applicable for high-speed dispensing.

It can be conductive pasted and scraped. The printing does not cause fraying, does not overflow or collapse, and has high pushing force without dislodging any componen

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SMT Red Glue

360g 100g

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商品规格：360g

Material properties before curing
Project	Parameters	Test methods/conditions
Appearance	Red gel substance	Visually compare the standard sample
Viscosity (Brookfield CAP2000+)	25000±15%cps(25℃、50rpm)	ASTM D4287
Specific gravity	1.27±0.1g/cm3	GB/T 13354-92
Flash point	>95℃（TCC）	GB/T 30777-2014
Particle size	10～15 μm	GB/T 1724-2019
Corrosion of copper mirrors	Non-corrosive	GBT 7326-1987
Working hours	48 hours (25℃, 50±10%RH)	/

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Next : Strong Bonding UV Curing Adhesive for Electronic Components , Moisture-Proof Non-Corrosive Fixing Glue

Parameters

商品规格：360g

Product Detail

Material properties before curing
Project	Parameters	Test methods/conditions
Appearance	Red gel substance	Visually compare the standard sample
Viscosity (Brookfield CAP2000+)	25000±15%cps(25℃、50rpm)	ASTM D4287
Specific gravity	1.27±0.1g/cm3	GB/T 13354-92
Flash point	>95℃（TCC）	GB/T 30777-2014
Particle size	10～15 μm	GB/T 1724-2019
Corrosion of copper mirrors	Non-corrosive	GBT 7326-1987
Working hours	48 hours (25℃, 50±10%RH)	/

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