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SMT surface mount red adhesive electronic components - SMT BGA adhesive paste stencil printing Fuji tube no detachment issue

The chip red glue is a one-component, high-temperature and rapid-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards. It has excellent thixotropic properties and is particularly suitable for manual steel screen printing and thick plate printing. It is also applicable for high-speed dispensing.

It can be conductive pasted and scraped. The printing does not cause fraying, does not overflow or collapse, and has high pushing force without dislodging any componen

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SMT surface mount red adhesive electronic components - SMT BGA adhesive paste stencil printing Fuji tube no detachment issue

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SMT Red Glue

360g 100g

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Product Detail Parameters

    Parameters
  • 商品规格360g


Material properties before curing
Project Parameters Test methods/conditions
Appearance Red gel substance Visually compare the standard sample
Viscosity (Brookfield CAP2000+) 25000±15%cps(25℃、50rpm) ASTM D4287
Specific gravity 1.27±0.1g/cm3 GB/T 13354-92
Flash point >95℃(TCC) GB/T 30777-2014
Particle size 10~15 μm GB/T 1724-2019
Corrosion of copper mirrors Non-corrosive GBT 7326-1987
Working hours 48 hours (25℃, 50±10%RH) /

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Parameters
  • 商品规格360g

Product Detail


Material properties before curing
Project Parameters Test methods/conditions
Appearance Red gel substance Visually compare the standard sample
Viscosity (Brookfield CAP2000+) 25000±15%cps(25℃、50rpm) ASTM D4287
Specific gravity 1.27±0.1g/cm3 GB/T 13354-92
Flash point >95℃(TCC) GB/T 30777-2014
Particle size 10~15 μm GB/T 1724-2019
Corrosion of copper mirrors Non-corrosive GBT 7326-1987
Working hours 48 hours (25℃, 50±10%RH) /

SMT surface mount red adhesive electronic components - SMT BGA adhesive paste stencil printing Fuji tube no detachment issue
The chip red glue is a one-component, high-temperature and rapid-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards. It has excellent thixotropic properties and is particularly suitable for manual steel screen printing and thick plate printing. It is also applicable for high-speed dispensing.

It can be conductive pasted and scraped. The printing does not cause fraying, does not overflow or collapse, and has high pushing force without dislodging any componen
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