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Silicone Two-component Potting Compound for Power Modules (Thermal Conductive/Waterproof Insulation AB Liquid Adhesive)

FD503-TG101 t is a low-viscosity two-component addition-cured silicone potting compound that can be cured at room temperature or by heating. It features a faster curing rate at higher temperatures. This product does not produce any by-products during the curing reaction and can be applied to the surfaces of materials such as PC(Poly-carbonate), PP, ABS, PVC and metals. It can be used in an environment ranging from -40℃ to 200℃. Fully complies with the requirements of the EU ROHS Directive.

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Silicone Two-component Potting Compound for Power Modules (Thermal Conductive/Waterproof Insulation AB Liquid Adhesive)

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Thermal conductive potting glue

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  • 商品规格25kg


Thermal insulating sealant 0.6W/m·K - 3W/m·K Technical parameters
Model FD503-TG101-6 FD503-TG101 FD503-TG20 FD503-TG301
Performance index A B A B A B A B
Before curing Appearance greyfluid white fluid greyfluid white fluid greyfluid white fluid greyfluid white fluid
Viscosity (cps) 1500~2500 2500±1000 4500-7500 12000~18000
Mixing ratio A:B (weight ratio) 1:1 1:1 1:1 1:1
Viscosity after mixing (cps) 1500~2500 2500±1000 4500-7500 12000~18000
Working Time (min) ≥30 ≥30 ≥30 ≥30
Curing Time (h) ≤6 ≤6 ≤6 ≤6
After curing Hardness 40-50 shore A 45-55 shore A 55-65 shore 00 10-20 shore 00
Thermal conductivity coefficient (W/m·K) ≥0.6 ≥0.9 2.0±0.1 ≥3.0
Dielectric intensity (KV/mm) ≥18 ≥15 ≥15 ≥15
Volume resistivity (Ω·cm) ≥1.0×1013 ≥1.0×1013 ≥1.0×1013 ≥1.0×1013
Density (g/cm³) 1.56±0.2 1.72±0.05 2.75±0.1 3.0±0.1
Flame retardant level UL94 V-0 V-0 V-0 V-0


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Parameters
  • 商品规格25kg

Product Detail


Thermal insulating sealant 0.6W/m·K - 3W/m·K Technical parameters
Model FD503-TG101-6 FD503-TG101 FD503-TG20 FD503-TG301
Performance index A B A B A B A B
Before curing Appearance greyfluid white fluid greyfluid white fluid greyfluid white fluid greyfluid white fluid
Viscosity (cps) 1500~2500 2500±1000 4500-7500 12000~18000
Mixing ratio A:B (weight ratio) 1:1 1:1 1:1 1:1
Viscosity after mixing (cps) 1500~2500 2500±1000 4500-7500 12000~18000
Working Time (min) ≥30 ≥30 ≥30 ≥30
Curing Time (h) ≤6 ≤6 ≤6 ≤6
After curing Hardness 40-50 shore A 45-55 shore A 55-65 shore 00 10-20 shore 00
Thermal conductivity coefficient (W/m·K) ≥0.6 ≥0.9 2.0±0.1 ≥3.0
Dielectric intensity (KV/mm) ≥18 ≥15 ≥15 ≥15
Volume resistivity (Ω·cm) ≥1.0×1013 ≥1.0×1013 ≥1.0×1013 ≥1.0×1013
Density (g/cm³) 1.56±0.2 1.72±0.05 2.75±0.1 3.0±0.1
Flame retardant level UL94 V-0 V-0 V-0 V-0


Silicone Two-component Potting Compound for Power Modules (Thermal Conductive/Waterproof Insulation AB Liquid Adhesive)
FD503-TG101 t is a low-viscosity two-component addition-cured silicone potting compound that can be cured at room temperature or by heating. It features a faster curing rate at higher temperatures. This product does not produce any by-products during the curing reaction and can be applied to the surfaces of materials such as PC(Poly-carbonate), PP, ABS, PVC and metals. It can be used in an environment ranging from -40℃ to 200℃. Fully complies with the requirements of the EU ROHS Directive.
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